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TS2PCIE2212ZAHR - Texas Instruments

Description: 4-channel PCIe 2:1 Multiplexer/Demultiplexer Passive FET Switch

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PCB Footprints
TS2PCIE2212ZAHR - Texas Instruments PCB footprint - BGA - BGA - ZAH0048A
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TS2PCIE2212ZAHR - Texas Instruments  - 3D model - BGA - ZAH0048A
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TS2PCIE2212ZAHR Details

  • Manufacturer Part Number:

    TS2PCIE2212ZAHR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    BGA

  • Pin Count:

    48

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Data Transfer Rate-Max:

    312.5 MBps

  • JESD-30 Code:

    S-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

TS2PCIE2212ZAHR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow the PCIe specification guidelines for PCB layout. Additionally, using a 4-layer PCB with a solid ground plane and a separate power plane can help reduce noise and improve signal integrity.
  • The TS2PCIE2212ZAHR has built-in hot-swapping and power sequencing capabilities. However, it's essential to follow the recommended power-up and power-down sequences in the datasheet to ensure proper operation. Additionally, consider using external power sequencing controllers or hot-swap controllers to manage the power-up and power-down of the PCIe interface.
  • The TS2PCIE2212ZAHR has a maximum junction temperature of 125°C. To ensure proper thermal management, use a heat sink or thermal pad on the exposed pad of the device, and follow the recommended thermal design guidelines in the datasheet. Additionally, consider using thermal simulation tools to optimize the thermal design of your system.
  • To troubleshoot signal integrity issues, use a high-speed oscilloscope to measure the signal quality and eye diagrams. Check for signal attenuation, jitter, and noise, and ensure that the signal is within the specified PCIe signal integrity requirements. Additionally, use simulation tools such as IBIS-AMI models to simulate the signal behavior and identify potential issues.
  • The TS2PCIE2212ZAHR is designed to meet PCIe EMI and RFI requirements. However, it's essential to follow proper PCB layout and shielding techniques to minimize EMI and RFI emissions. Use a metal shield or EMI gasket to enclose the device, and ensure that the PCB layout is designed to minimize radiation and coupling.

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TS2PCIE2212ZAHR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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