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TS3702CD - STMicroelectronics

Description: 2.7V ~ 16V, Micropower dual CMOS voltage Comparator Standard (General Purpose) CMOS, Push-Pull 8-SOIC

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TS3702CD - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_2022
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TS3702CD - STMicroelectronics  - 3D model - Small Outline Packages - SO-8_2022
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TS3702CD Details

  • Manufacturer Part Number:

    TS3702CD

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MICRO, PLASTIC, SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Input Offset Voltage-Max:

    6500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    1500 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TS3702CD Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TS3702CD has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and avoid blocking the airflow with nearby components.
  • The TS3702CD is rated for operation from -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Ensure that the device is operated within the recommended temperature range to prevent damage or degradation.
  • Handle the TS3702CD with care to prevent ESD damage. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded. Avoid touching the device pins or handling the device in a way that could generate static electricity.
  • The recommended input capacitance for the TS3702CD is 10nF to 100nF, depending on the specific application and noise requirements. A larger input capacitance can help filter out noise and improve stability, but may also increase the startup time.

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TS3702CD Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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