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TS3A226AEYFFR - Texas Instruments

Description: Autonomous Audio Headset Switch with Reduced GND Switch RON and FM Capability

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PCB Footprints
TS3A226AEYFFR - Texas Instruments PCB footprint - BGA - BGA - YFF0009_0.625H
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3D Models
TS3A226AEYFFR - Texas Instruments  - 3D model - BGA - YFF0009_0.625H
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TS3A226AEYFFR Details

  • Manufacturer Part Number:

    TS3A226AEYFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : Audio jack

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • Bandwidth-Nom:

    200 MHz

  • Input Voltage-Max:

    4.5 V

  • Input Voltage-Min:

    2.6 V

  • JESD-30 Code:

    S-XBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    1.4 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    9

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance-Max (Ron):

    85 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.425 mm

  • Supply Current-Max (Isup):

    0.014 mA

  • Supply Voltage-Max (Vsup):

    4.7 V

  • Supply Voltage-Min (Vsup):

    2.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.4 mm

TS3A226AEYFFR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3A226AEYFFR involves keeping the signal traces short and direct, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve signal integrity.
  • To ensure proper power and decoupling, use a high-quality power supply with low noise and ripple, and decouple the device with a 0.1uF ceramic capacitor and a 10uF electrolytic capacitor in parallel, placed as close to the device as possible.
  • The TS3A226AEYFFR can support data rates up to 100 Mbps, but the actual data rate may be limited by the specific application and the quality of the signal transmission lines.
  • To troubleshoot signal integrity issues, use an oscilloscope to measure the signal waveforms and check for signal distortion, ringing, or overshoot. Also, check the PCB layout and the device's power supply and decoupling to ensure they are adequate.
  • The TS3A226AEYFFR is rated for operation up to 85°C, but it can be used in high-temperature environments with proper thermal management, such as heat sinks or thermal interfaces, to ensure the device does not exceed its maximum junction temperature.

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TS3A226AEYFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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