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TS3A227EYFFR - Texas Instruments

Description: Autonomous Audio Accessory Detection and Configuration Switch

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PCB Footprints
TS3A227EYFFR - Texas Instruments PCB footprint - BGA - BGA - YFF0016_2020-1
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3D Models
TS3A227EYFFR - Texas Instruments  - 3D model - BGA - YFF0016_2020-1
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TS3A227EYFFR Details

  • Manufacturer Part Number:

    TS3A227EYFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : Audio jack

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • Bandwidth-Nom:

    150 MHz

  • Input Voltage-Max:

    4.5 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    S-XBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    1.756 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance-Max (Ron):

    30000 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X4,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max (Isup):

    0.045 mA

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5000 ns

  • Switch-on Time-Max:

    35000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.756 mm

TS3A227EYFFR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3A227EYFFR involves keeping the signal traces short and away from the power planes, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI.
  • The TS3A227EYFFR requires a single 1.8V to 3.6V power supply. It's recommended to power the device with a clean, low-noise power supply, and to ensure that the power supply is stable before applying signals to the device. Power sequencing is not critical, but it's recommended to power the device after the power supply has stabilized.
  • The TS3A227EYFFR has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Additionally, minimize the power consumption and reduce the operating frequency to reduce heat generation.
  • To troubleshoot issues with the TS3A227EYFFR, use a logic analyzer or oscilloscope to capture the signals and verify that they meet the device's specifications. Check the power supply and ensure it's stable and within the recommended range. Also, review the PCB layout and ensure it meets the recommended layout guidelines.
  • The TS3A227EYFFR has built-in ESD protection, but it's still important to handle the device with care and follow proper ESD protection procedures during handling and assembly. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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TS3A227EYFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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