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TS3A27518EZQSR - Texas Instruments

Description: 6-Bit, 1-of-2 Mux/Demux with 240 MHz Bandwidth

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TS3A27518EZQSR - Texas Instruments - PCB symbol
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PCB Footprints
TS3A27518EZQSR - Texas Instruments PCB footprint - BGA - BGA - ZQS(S-PBGA-N24)_2021
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3D Models
TS3A27518EZQSR - Texas Instruments - 3D model - BGA - ZQS(S-PBGA-N24)_2021
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TS3A27518EZQSR Details

  • Manufacturer Part Number:

    TS3A27518EZQSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-24

  • Pin Count:

    24

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    240 MHz

  • Input Voltage-Max:

    3.6 V

  • JESD-30 Code:

    S-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.3 Ω

  • On-state Resistance-Max (Ron):

    14.4 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA24,5X5,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.05 A

  • Supply Current-Max (Isup):

    0.005 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    31.2 ns

  • Switch-on Time-Max:

    56.7 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TS3A27518EZQSR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3A27518EZQSR involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
  • The TS3A27518EZQSR requires a single 1.8V power supply. Ensure that the power supply is clean and well-regulated. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized. TI recommends a power-up sequence of VCC followed by VREF.
  • The TS3A27518EZQSR supports data rates up to 5.9 Gbps. However, the actual data rate achievable depends on the system design, PCB layout, and signal integrity. TI recommends following the datasheet guidelines and application notes for optimal performance.
  • The TS3A27518EZQSR has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate in high-temperature environments. TI provides thermal management guidelines in the datasheet.
  • The TS3A27518EZQSR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Latch-up prevention can be achieved by following the recommended PCB layout and signal routing guidelines in the datasheet.

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TS3A27518EZQSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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