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TS3A5017DBQR - Texas Instruments

Description: 14-Ohm Dual SP4T Analog Switch 3.3-V/2.5-V Analog Multiplexer/Demultiplexer

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PCB Footprints
TS3A5017DBQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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TS3A5017DBQR - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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TS3A5017DBQR Details

  • Manufacturer Part Number:

    TS3A5017DBQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 4:1

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    165 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NC

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    48 dB

  • On-state Resistance Match-Nom:

    1 Ω

  • On-state Resistance-Max (Ron):

    24 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    6 ns

  • Switch-on Time-Max:

    10 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TS3A5017DBQR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3A5017DBQR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI.
  • The TS3A5017DBQR requires a single 1.8V to 3.6V power supply. It's recommended to power the device with a clean, low-noise power supply, and to sequence the power-on in the following order: VCC, then VIN. A 10uF capacitor on the VCC pin and a 1uF capacitor on the VIN pin are recommended to filter out noise.
  • The TS3A5017DBQR can support data rates up to 100 Mbps, but the actual data rate achieved will depend on the specific application, PCB layout, and signal quality.
  • The TS3A5017DBQR has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, improving air flow, and reducing power consumption. In high-temperature environments, consider using a thermal interface material and a heat sink with a thermal conductivity of at least 1 W/m-K.
  • The TS3A5017DBQR has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Additionally, consider adding external ESD protection devices, such as TVS diodes, to further protect the device.

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TS3A5017DBQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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