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TS3A5017DGVR - Texas Instruments

Description: 14-Ohm Dual SP4T Analog Switch 3.3-V/2.5-V Analog Multiplexer/Demultiplexer

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TS3A5017DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV-16
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TS3A5017DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV-16
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TS3A5017DGVR Details

  • Manufacturer Part Number:

    TS3A5017DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 4:1

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    165 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    48 dB

  • On-state Resistance Match-Nom:

    1 Ω

  • On-state Resistance-Max (Ron):

    24 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    6 ns

  • Switch-on Time-Max:

    10 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.6 mm

TS3A5017DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-speed PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines.
  • The TS3A5017DGVR has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal pad on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The TS3A5017DGVR is capable of supporting data rates up to 4 Gbps, but the actual data rate achieved will depend on the specific application, PCB layout, and signal integrity.
  • The TS3A5017DGVR is a voltage-mode switch, and the voltage level can be configured by adjusting the voltage on the VCC pin. The device can operate from 1.65 V to 3.6 V, and the voltage level should be set according to the specific application requirements.
  • The power consumption of the TS3A5017DGVR depends on the operating frequency, voltage, and other factors. According to the datasheet, the typical power consumption is around 10 μA at 1.8 V and 100 kHz, but this can vary depending on the specific application.

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TS3A5017DGVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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