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TS3A5017RGYR - Texas Instruments

Description: 14-Ohm Dual SP4T Analog Switch 3.3-V/2.5-V Analog Multiplexer/Demultiplexer

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PCB Footprints
TS3A5017RGYR - Texas Instruments PCB footprint - Other - Other - RGY(R-PVQFN-N16)
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3D Models
TS3A5017RGYR - Texas Instruments  - 3D model - Other - RGY(R-PVQFN-N16)
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TS3A5017RGYR Details

  • Manufacturer Part Number:

    TS3A5017RGYR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 4:1

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    165 MHz

  • JESD-30 Code:

    R-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NC

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    48 dB

  • On-state Resistance Match-Nom:

    1 Ω

  • On-state Resistance-Max (Ron):

    24 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16/20,.14X.16,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    6 ns

  • Switch-on Time-Max:

    10 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

TS3A5017RGYR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3A5017RGYR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI.
  • The TS3A5017RGYR requires a single 1.8V to 3.6V power supply. It's recommended to power the device with a clean, low-noise power supply, and to sequence the power-on in the following order: VCC, then VIN. A 10uF capacitor on the VCC pin and a 1uF capacitor on the VIN pin are recommended to filter out noise.
  • The TS3A5017RGYR can achieve data rates up to 100 Mbps. However, the actual data rate achieved will depend on the system design, PCB layout, and signal quality. The device's bandwidth is limited by the internal capacitance and the output impedance, which can affect the signal integrity at high frequencies.
  • The TS3A5017RGYR has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. A thermal pad on the bottom of the package helps to dissipate heat. A heat sink or a thermal interface material can be used to further improve heat dissipation.
  • The TS3A5017RGYR has built-in ESD protection diodes on the input pins. However, it's still recommended to use external ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge. Additionally, the device is designed to prevent latch-up, but it's still important to follow proper PCB design and layout practices to minimize the risk of latch-up.

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TS3A5017RGYR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Single-Ended Multiplexer, 2 Func, 2 Channel, CMOS, PQCC16