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TS3DV520RHUR - Texas Instruments

Description: Multi-channel differential switch & multiplexer targeting DVI & HDMI applications

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PCB Footprints
TS3DV520RHUR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHU (R-PWQFN-N56)
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3D Models
TS3DV520RHUR - Texas Instruments  - 3D model - Quad Flat No-Lead - RHU (R-PWQFN-N56)
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TS3DV520RHUR Details

  • Manufacturer Part Number:

    TS3DV520RHUR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    AUDIO/VIDEO SWITCH

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PQCC-N56

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Off-state Isolation-Nom:

    39 dB

  • On-state Resistance Match-Nom:

    0.4 Ω

  • On-state Resistance-Max (Ron):

    6 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.19X.43,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    9 ns

  • Switch-on Time-Max:

    15 ns

  • Switching:

    MAKE-BEFORE-BREAK

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TS3DV520RHUR Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the input and output traces short and away from each other, and using thermal vias to dissipate heat. Additionally, a thermal pad on the bottom of the package can be connected to a ground plane to improve heat dissipation.
  • To ensure signal integrity and minimize EMI emissions, it is recommended to use a low-impedance PCB material, keep signal traces short and away from each other, and use shielding or guard rings around sensitive signals. Additionally, using a common-mode choke or ferrite bead on the output can help reduce EMI emissions.
  • The recommended power-up sequence is to apply the analog supply voltage (VCCA) first, followed by the digital supply voltage (VCCD). During power-down, the sequence should be reversed. It is also recommended to add a power-on reset circuit to ensure the device is properly reset during power-up.
  • To handle the device's power consumption and heat generation, it is recommended to use a heat sink or thermal pad on the package, and to ensure good airflow around the device. Additionally, using a low-dropout regulator (LDO) or a switching regulator can help reduce power consumption and heat generation.
  • The recommended test and measurement procedures for the device include using a high-speed oscilloscope to measure the output signal, and using a signal generator to test the device's frequency response. Additionally, using a logic analyzer can help debug digital signals and ensure proper device operation.

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TS3DV520RHUR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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