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TS3L100DGVR - Texas Instruments

Description: Quad SPDT Wide Bandwidth LAN Switch with Low On-State Resistance

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TS3L100DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G16)
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TS3L100DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G16)
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TS3L100DGVR Details

  • Manufacturer Part Number:

    TS3L100DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    350 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    42 dB

  • On-state Resistance Match-Nom:

    1 Ω

  • On-state Resistance-Max (Ron):

    15000 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    3.5 ns

  • Switch-on Time-Max:

    7.5 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.6 mm

TS3L100DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, use a 50-ohm transmission line impedance and avoid vias near the signal paths.
  • Use a 100-ohm differential termination resistor (e.g., 0402 or 0603 package) between the differential signal pairs (e.g., IN+/IN- or OUT+/OUT-). Place the termination resistor as close to the device as possible.
  • The maximum cable length depends on the signal frequency and the type of cable used. As a general guideline, Texas Instruments recommends keeping the cable length below 10 inches (25 cm) for frequencies up to 1 GHz. For longer cables, use a repeater or a signal conditioner to maintain signal integrity.
  • The TS3L100DGVR is a general-purpose differential switch, and its configuration depends on the specific application. Consult the datasheet and application notes for guidance on configuring the device for specific data rates or protocols, such as USB, SATA, or PCIe.
  • The TS3L100DGVR has a typical power consumption of 10 mA at 3.3 V. Power the device using a 3.3 V or 1.8 V supply, depending on the specific application requirements. Ensure the power supply is clean and well-regulated to prevent signal integrity issues.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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