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TS3L110DE4 - Texas Instruments

Description: TEXAS INSTRUMENTS - TS3L110DE4 . - Analog Multiplexer / Demultiplexer, 4 Circuits, 8 ohm, 700 µA, 3V to 3.6V, SOIC-16

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TS3L110DE4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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TS3L110DE4 - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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TS3L110DE4 Details

  • Manufacturer Part Number:

    TS3L110DE4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Mexico

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    500 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    28 dB

  • On-state Resistance Match-Nom:

    0.9 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5 ns

  • Switch-on Time-Max:

    7 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TS3L110DE4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines for the high-speed signals.
  • To ensure signal integrity, use a controlled impedance PCB, terminate the transmission lines properly, and use a common mode filter or a common mode choke to reduce electromagnetic interference (EMI). Additionally, use a signal integrity analysis tool to simulate and optimize the design.
  • The maximum operating temperature range for the TS3L110DE4 is -40°C to 85°C. However, it's essential to consider the thermal design and heat dissipation in the system to ensure reliable operation within this range.
  • The TS3L110DE4 is a programmable device, and Texas Instruments provides a software development kit (SDK) and a programming guide to help with configuration and programming. The device can be programmed using a serial interface, such as I2C or SPI.
  • The power consumption of the TS3L110DE4 depends on the operating frequency, voltage, and mode of operation. According to the datasheet, the typical power consumption is around 150 mW at 1.8 V and 100 MHz. However, it's essential to consider the power consumption in the system design and ensure adequate power supply and heat dissipation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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