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TS3L110PWR - Texas Instruments

Description: Quad SPDT High-Bandwidth 10/100 Base-T Lan Switch Differential 8 to 4 Multiplexer/Demultiplexer

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TS3L110PWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0016A
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TS3L110PWR - Texas Instruments  - 3D model - Small Outline Packages - PW0016A
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TS3L110PWR Details

  • Manufacturer Part Number:

    TS3L110PWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    500 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    28 dB

  • On-state Resistance Match-Nom:

    0.9 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    5 ns

  • Switch-on Time-Max:

    7 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

TS3L110PWR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS3L110PWR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power source. Additionally, using a common mode choke and shielding can help reduce EMI.
  • To ensure the TS3L110PWR operates within its SOA, monitor the device's junction temperature (TJ) and ensure it does not exceed 150°C. Also, keep the input voltage within the recommended range, and avoid excessive output current or voltage.
  • When selecting input and output capacitors for the TS3L110PWR, consider the capacitor's voltage rating, capacitance value, and equivalent series resistance (ESR). Choose capacitors with a voltage rating higher than the input voltage, and ensure the ESR is low enough to minimize voltage ripple.
  • To troubleshoot issues with the TS3L110PWR, start by checking the input voltage and current, output voltage and current, and device temperature. Verify that the device is properly soldered and the PCB layout is correct. Use an oscilloscope to check for voltage ripple and noise, and consult the datasheet and application notes for guidance.
  • Operating the TS3L110PWR at high ambient temperatures can reduce its reliability and lifespan. To mitigate this, ensure good airflow around the device, use a heat sink if necessary, and consider derating the device's output current and voltage. Consult the datasheet for temperature-related specifications and guidelines.

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TS3L110PWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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