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TS3L301DGGRG4 - Texas Instruments

Description: Switch ICs - Various 16B-8B SPDT Gigabit LAN Sw

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TS3L301DGGRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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TS3L301DGGRG4 - Texas Instruments  - 3D model - Small Outline Packages - DGG0048A
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TS3L301DGGRG4 Details

  • Manufacturer Part Number:

    TS3L301DGGRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    900 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Off-state Isolation-Nom:

    39 dB

  • On-state Resistance Match-Nom:

    1.2 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Signal Current-Max:

    0.128 A

  • Supply Current-Max (Isup):

    0.6 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    8.5 ns

  • Switch-on Time-Max:

    11.5 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TS3L301DGGRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-frequency design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines to ensure signal integrity.
  • To minimize high-frequency noise, use a low-pass filter or a ferrite bead in series with the switch output, and ensure proper grounding and shielding of the PCB. Additionally, consider using a spread-spectrum clock or a clock jitter cleaner to reduce EMI.
  • The TS3L301DGGRG4 is capable of supporting data rates up to 3.2 Gbps, but the actual data rate achievable depends on the specific application, PCB design, and signal quality. It's recommended to perform signal integrity simulations and testing to determine the maximum data rate for your specific use case.
  • To ensure signal integrity, use a high-quality PCB material, maintain a consistent impedance, and minimize signal reflections. Additionally, consider using signal conditioning components, such as terminators or equalizers, to improve signal quality.
  • The power consumption of the TS3L301DGGRG4 depends on the operating frequency, voltage, and mode of operation. To reduce power consumption, consider using a lower operating frequency, reducing the supply voltage, or using the switch's power-down mode when not in use.

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TS3L301DGGRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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