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TS3USB221ARSERG4 - Texas Instruments

Description: USB Switch ICs ESD Prot Hi-Spd USB 2.0 1:2 Mux/Demux Sw

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PCB Footprints
TS3USB221ARSERG4 - Texas Instruments PCB footprint - Other - Other - TS3USB221ARSERG4-2
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3D Models
TS3USB221ARSERG4 - Texas Instruments  - 3D model - Other - TS3USB221ARSERG4-2
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TS3USB221ARSERG4 Details

  • Manufacturer Part Number:

    TS3USB221ARSERG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    10

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    900 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    41 dB

  • On-state Resistance Match-Nom:

    0.2 Ω

  • On-state Resistance-Max (Ron):

    6 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    17 ns

  • Switch-on Time-Max:

    10 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

TS3USB221ARSERG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use termination resistors as recommended in the datasheet. Additionally, use a common mode filter or a common mode choke to reduce electromagnetic interference (EMI).
  • The maximum cable length supported by the TS3USB221ARSERG4 depends on the specific application and the type of cable used. As a general guideline, the device supports cable lengths up to 3 meters for USB 2.0 and 1 meter for USB 3.2 Gen 1. However, it's recommended to consult the datasheet and perform signal integrity simulations to determine the maximum cable length for a specific application.
  • To configure the TS3USB221ARSERG4 for USB 3.2 Gen 2 operation, set the MODE pin to a logic high state and ensure that the device is powered from a 3.3V supply. Additionally, use a USB 3.2 Gen 2-compliant cable and ensure that the signal traces are designed to support the higher data rates.
  • The power consumption of the TS3USB221ARSERG4 depends on the operating mode and the data rate. According to the datasheet, the typical power consumption is around 150 mA for USB 2.0 operation and 250 mA for USB 3.2 Gen 1 operation. However, it's recommended to consult the datasheet and perform power consumption simulations to determine the exact power consumption for a specific application.

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TS3USB221ARSERG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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