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TS3USBCA410RSVT - Texas Instruments

Description: USB Type-C SBU Multiplexer

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PCB Footprints
TS3USBCA410RSVT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RSV0016A
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3D Models
TS3USBCA410RSVT - Texas Instruments  - 3D model - Quad Flat No-Lead - RSV0016A
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TS3USBCA410RSVT Details

  • Manufacturer Part Number:

    TS3USBCA410RSVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 3:1,4:1

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    500 MHz

  • JESD-30 Code:

    R-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    70 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    7.5 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.07X.1,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max (Isup):

    0.07 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    650 ns

  • Switch-on Time-Max:

    1200 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

TS3USBCA410RSVT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and routing guide in the TS3USBCA410RSVT evaluation module documentation. It's essential to follow these guidelines to minimize signal integrity issues and ensure optimal performance.
  • The TS3USBCA410RSVT requires a specific power sequencing and voltage regulation scheme. TI recommends using an external power management IC (PMIC) or a dedicated power supply circuit to ensure proper power-up and power-down sequencing.
  • The TS3USBCA410RSVT has a thermal pad that must be connected to a thermal ground plane or a heat sink to dissipate heat. Ensure that your PCB design and thermal management strategy can handle the device's power dissipation and thermal characteristics.
  • TI provides example code and application notes for implementing and testing the I2C and USB interfaces. Additionally, use TI's USB Redriver and USB Switch evaluation software to test and debug the device's USB interface.
  • The TS3USBCA410RSVT has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures. Additionally, ensure that your system design meets the required surge immunity standards, such as IEC 61000-4-2 and IEC 61000-4-5.

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TS3USBCA410RSVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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