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TS512AIN - STMicroelectronics

Description: 3V ~ 30V, Precision dual operational amplifiers Standard (General Purpose) Amplifier 2 Circuit 8-Mini DIP

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TS512AIN - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8 PINS - PLASTIC DIP
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TS512AIN - STMicroelectronics  - 3D model - Dual-In-Line Packages - 8 PINS - PLASTIC DIP
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TS512AIN Details

  • Manufacturer Part Number:

    TS512AIN

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    LEAD FREE, PLASTIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.3 µA

  • Bias Current-Max (IIB) @25C:

    0.15 µA

  • Common-mode Reject Ratio-Min:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    7.62 mm

TS512AIN Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The TS512AIN has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. The application note AN5323 provides more details on thermal management.
  • The TS512AIN is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability.
  • The TS512AIN has a gain select pin (GAIN_SEL) that can be connected to VCC, GND, or left floating to select one of three gain settings. The gain settings are described in the datasheet, and the application note AN5323 provides more details on gain configuration.
  • The recommended input impedance for the TS512AIN is 50 ohms, which is the standard impedance for most RF and microwave applications. However, the input impedance can be adjusted using external components to match the specific requirements of the application.

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TS512AIN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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