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TS53YL501MR10 - Vishay

Description: 500 Ohms 0.25W, 1/4W Gull Wing Surface Mount Trimmer Potentiometer Cermet 1.0 Turn Top Adjustment

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Symbol
TS53YL501MR10 - Vishay - PCB symbol
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PCB Footprints
TS53YL501MR10 - Vishay PCB footprint - Other - Other - 5 mm x 5 mm x 2.7 mm
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3D Models
TS53YL501MR10 - Vishay - 3D model - Other - 5 mm x 5 mm x 2.7 mm
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TS53YL501MR10 Details

  • Manufacturer Part Number:

    TS53YL501MR10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Actuator Orientation:

    VERTICAL

  • Actuator Type:

    SCREW

  • Construction:

    Rectangular

  • Ganging Number:

    1

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    3

  • Number of Turns:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.7 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    CECC41000

  • Resistance:

    500 Ω

  • Resistance Law:

    LINEAR

  • Resistor Type:

    TRIMMER

  • Rotational Angle:

    220 deg

  • Size Code:

    2020

  • Surface Mount:

    YES

  • Technology:

    CERMET

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    GULL WING

  • Tolerance:

    20%

  • Working Voltage:

    11.2 V

TS53YL501MR10 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TS53YL501MR10 is a rectangle with dimensions of 5.3mm x 3.3mm, with a pad size of 2.5mm x 1.5mm and a pitch of 1.5mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB with a minimum size of 5mm x 5mm. The thermal pad should be connected to a copper plane or a heat sink to dissipate heat efficiently. Additionally, ensure that the component is placed in a well-ventilated area to prevent overheating.
  • The maximum operating temperature range for the TS53YL501MR10 is -40°C to +125°C. However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • The TS53YL501MR10 is designed to withstand moderate vibration levels. However, it's essential to ensure that the PCB is properly secured and the component is mounted using a suitable adhesive or mechanical fastening method to prevent damage or detachment during vibration.
  • The recommended storage condition for the TS53YL501MR10 is in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures during storage.

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TS53YL501MR10 Overview

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