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TS5A3159DCKT - Texas Instruments

Description: Texas Instruments TS5A3159DCKT, Analogue SPDT Switch Single SPDT, 3 V, 5 V, 6-Pin SC-70

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PCB Footprints
TS5A3159DCKT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - dck
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3D Models
TS5A3159DCKT - Texas Instruments  - 3D model - SOT23 (6-Pin) - dck
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TS5A3159DCKT Details

  • Manufacturer Part Number:

    TS5A3159DCKT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    2-CHANNEL MUX/DEMUX

  • Analog IC - Other Type:

    SPDT

  • Bandwidth-Nom:

    100 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    63 dB

  • On-state Resistance Match-Nom:

    0.7 Ω

  • On-state Resistance-Max (Ron):

    3.2 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    70 ns

  • Switch-on Time-Max:

    95 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

TS5A3159DCKT Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS5A3159DCKT involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce EMI.
  • The TS5A3159DCKT requires a single 3.3V power supply. It's recommended to power the device using a low-dropout linear regulator or a switching regulator with a low noise output. The power sequencing requirement is to power up the VCC pin before the VIN pin.
  • The TS5A3159DCKT can achieve data rates up to 100 Mbps. However, the actual data rate may be limited by the capacitance of the transmission line, the signal attenuation, and the noise margin. It's recommended to use a signal integrity analysis tool to determine the maximum achievable data rate for a specific application.
  • To troubleshoot issues with the TS5A3159DCKT, use an oscilloscope to measure the signal waveform and check for signal integrity issues such as ringing, overshoot, or undershoot. For power supply noise issues, use a spectrum analyzer to measure the power supply noise and check for any noise peaks that may be affecting the device's performance.
  • The TS5A3159DCKT has a maximum junction temperature of 150°C. To ensure the device operates within its recommended temperature range, use a thermal pad or a heat sink to dissipate heat, and ensure good airflow around the device. It's also recommended to use a thermal interface material to improve heat transfer between the device and the heat sink.

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TS5A3159DCKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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