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TS5A3359YZPR - Texas Instruments

Description: 1-Ohm SP3T Analog Switch 5-V/3.3-V Single-Channel 3:1 Multiplexer/Demultiplexer

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PCB Footprints
TS5A3359YZPR - Texas Instruments PCB footprint - BGA - BGA - YZP0008
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TS5A3359YZPR - Texas Instruments  - 3D model - BGA - YZP0008
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TS5A3359YZPR Details

  • Manufacturer Part Number:

    TS5A3359YZPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 3:1

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • Bandwidth-Nom:

    75 MHz

  • Input Voltage-Max:

    5.5 V

  • JESD-30 Code:

    R-XBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    1.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    64 dB

  • On-state Resistance Match-Nom:

    0.15 Ω

  • On-state Resistance-Max (Ron):

    2.5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA8,2X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    16 ns

  • Switch-on Time-Max:

    85 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.9 mm

TS5A3359YZPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS5A3359YZPR involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces to reduce noise and capacitance. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure proper power and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between VCC and GND, and a 1 μF capacitor between VCC and AVCC. Additionally, use a 10 μF capacitor between AVCC and GND for analog power supply decoupling.
  • The TS5A3359YZPR can support data rates up to 400 Mbps, but the actual data rate depends on the system design, PCB layout, and signal integrity. TI recommends following the recommended PCB layout and signal integrity guidelines to achieve the highest data rates.
  • The TS5A3359YZPR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Use ESD-protective packaging, wrist straps, and mats to prevent damage during handling and assembly.
  • The TS5A3359YZPR has a maximum junction temperature of 150°C. Ensure good thermal conduction by using a heat sink or thermal pad, and avoid blocking airflow around the device. Follow TI's thermal design guidelines for optimal thermal performance.

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TS5A3359YZPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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