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TS5MP645NYFPR - Texas Instruments

Description: 4-Data Lane 2:1 MIPI Switch (10-Channel, 2:1 Analog Switch)

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PCB Footprints
TS5MP645NYFPR - Texas Instruments PCB footprint - BGA - BGA - YFP0036
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TS5MP645NYFPR - Texas Instruments  - 3D model - BGA - YFP0036
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TS5MP645NYFPR Details

  • Manufacturer Part Number:

    TS5MP645NYFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-02-04

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    4

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    1500 MHz

  • Input Voltage-Max:

    3.6 V

  • JESD-30 Code:

    S-XBGA-B36

  • JESD-609 Code:

    e1

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Off-state Isolation-Nom:

    20 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    6500 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA36,6X6,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    300000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.6 mm

TS5MP645NYFPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TS5MP645NYFPR involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure proper power and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between VCC and GND, and a larger capacitor (e.g., 10 μF) for bulk decoupling. Place these capacitors close to the device, and use a low-inductance path to the power supply.
  • The TS5MP645NYFPR can operate up to 1.5 GHz, but the maximum frequency depends on the specific application and signal integrity. TI recommends following the datasheet guidelines and performing simulations to ensure signal integrity.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and follow TI's thermal design guidelines. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.
  • Handle the TS5MP645NYFPR with ESD-protective equipment and follow proper handling procedures to prevent damage. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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