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TSB12LV26TPZEP - Texas Instruments

Description: Enhanced Product Ohci-Lynx Pci-Based Ieee 1394 Host Controller

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TSB12LV26TPZEP - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PZ (S-PQFP-G100)
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3D Models
TSB12LV26TPZEP - Texas Instruments  - 3D model - Quad Flat Packages - PZ (S-PQFP-G100)
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TSB12LV26TPZEP Details

  • Manufacturer Part Number:

    TSB12LV26TPZEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    32

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    33 MHz

  • Data Transfer Rate-Max:

    50 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

TSB12LV26TPZEP Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the TSB12LV26TPZEP is -40°C to 125°C.
  • To ensure signal integrity, use a low-impedance PCB design, keep signal traces short, and use termination resistors as recommended in the datasheet.
  • Yes, the TSB12LV26TPZEP is designed to withstand high-vibration environments, but ensure proper PCB mounting and soldering to prevent mechanical stress.
  • Handle the TSB12LV26TPZEP with ESD-protective equipment, such as wrist straps and mats, to prevent damage from electrostatic discharge.
  • The recommended power-up sequence is to apply VCC first, followed by VTT, and then the input signals.

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TSB12LV26TPZEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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