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TSB514IDT - STMicroelectronics

Description: Rail-to-rail inputs and outputs, 36 V, 6 MHz op amps

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TSB514IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - L6494LDTR
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TSB514IDT Details

  • Manufacturer Part Number:

    TSB514IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-14

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.1 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    14

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    2 V/us

  • Slew Rate-Nom:

    2.7 V/us

  • Supply Current-Max:

    12 mA

  • Supply Voltage Limit-Max:

    40 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Tin (Sn) - immersion

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    6000

  • Voltage Gain-Min:

    177827

  • Wideband:

    NO

  • Width:

    3.9 mm

TSB514IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The TSB514IDT has a thermal pad that must be connected to a heat sink or a thermal plane on the PCB to dissipate heat. Ensure that the thermal pad is soldered to a copper area on the PCB, and consider using thermal vias to improve heat dissipation. Additionally, follow the thermal management guidelines in the datasheet and application notes.
  • The TSB514IDT has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Ensure that the device is operated within the recommended temperature range to prevent damage or malfunction.
  • To configure the TSB514IDT for high-speed data transmission, ensure that the input signals are properly terminated, and the output signals are properly loaded. Additionally, follow the guidelines for signal integrity, such as using differential signaling, and consider using a signal integrity model to optimize the design.
  • STMicroelectronics recommends using a decoupling capacitor with a value of 100 nF to 1 μF, placed as close as possible to the power supply pins of the TSB514IDT. This helps to reduce noise and ensure stable operation.

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TSB514IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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