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TSB582IDT - STMicroelectronics

Description: 200 mA output current with thermal shutdown and output current limiter, 3.1 MHz, 36 V, BiCMOS dual operational amplifier

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TSB582IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSO-8_2022-1
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TSB582IDT - STMicroelectronics  - 3D model - Small Outline Packages - PowerSO-8_2022-1
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TSB582IDT Details

  • Manufacturer Part Number:

    TSB582IDT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.002 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.7 mm

  • Slew Rate-Nom:

    1.7 V/us

  • Supply Current-Max:

    7 mA

  • Supply Voltage Limit-Max:

    42 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    2700

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

TSB582IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5096, which includes guidelines for thermal pad connection, copper pouring, and via placement to ensure optimal thermal performance.
  • The TSB582IDT has a built-in thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To handle this, ensure proper heat sinking, follow the recommended PCB layout, and consider adding thermal monitoring and shutdown circuitry in your design.
  • Although the datasheet specifies a recommended operating voltage range of 3.3V to 5V, the absolute maximum rating for the VCC pin is 6V. However, it's essential to operate within the recommended range to ensure device reliability and performance.
  • Yes, the TSB582IDT is suitable for high-frequency applications up to 100 MHz. However, it's crucial to follow proper PCB layout and routing guidelines, use suitable decoupling capacitors, and consider the device's propagation delay and rise/fall times in your design.
  • To ensure EMC, follow proper PCB layout and routing guidelines, use shielding and grounding techniques, and consider adding electromagnetic interference (EMI) filters or common-mode chokes in your design. Additionally, ensure that your design meets the relevant EMC standards and regulations.

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TSB582IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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