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TSC103IYDT - STMicroelectronics

Description: High-voltage, high-side current sense amplifier

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TSC103IYDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_2022
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TSC103IYDT - STMicroelectronics  - 3D model - Small Outline Packages - SO 8_2022
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TSC103IYDT Details

  • Manufacturer Part Number:

    TSC103IYDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    0.7 MHz

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    1100 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    8

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.4 V/us

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.48 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Wideband:

    NO

  • Width:

    3.9 mm

TSC103IYDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4071, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The thermal shutdown feature is designed to protect the device from overheating. When the junction temperature exceeds 150°C, the device will shut down. To handle this, ensure proper thermal management, such as using a heat sink, and implement a thermal monitoring and shutdown strategy in your system design.
  • The TSC103IYDT can drive capacitive loads up to 100 nF. However, it's recommended to consult the application note AN4071 for guidelines on capacitive load calculation and compensation to ensure stable operation.
  • The TSC103IYDT has an internal overvoltage protection (OVP) circuit that triggers when the input voltage exceeds 6.5 V. To implement additional OVP, consider using an external voltage supervisor or a dedicated OVP IC to ensure the device is protected from voltage transients and surges.
  • STMicroelectronics recommends using a pi-filter (R-C-R) or an LC filter at the input to reduce electromagnetic interference (EMI) and ensure stable operation. The application note AN4071 provides guidelines for filter component selection and layout.

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TSC103IYDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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