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TSC210ICT - STMicroelectronics

Description: High/low-side, bidirectional, zero-drift current sense amplifiers

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TSC210ICT - STMicroelectronics PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC70-6
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TSC210ICT - STMicroelectronics  - 3D model - SOT23 (6-Pin) - SC70-6
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TSC210ICT Details

  • Manufacturer Part Number:

    TSC210ICT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 6 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2020-03-09

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    35 µA

  • Bias Current-Max (IIB) @25C:

    35 µA

  • Common-mode Reject Ratio-Min:

    105 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    35 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    6

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    0.115 mA

  • Supply Voltage Limit-Max:

    26 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn) - immersion

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    35.25

  • Wideband:

    NO

  • Width:

    1.25 mm

TSC210ICT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TSC210ICT requires calibration to compensate for variations in the touch sensor and the environment. STMicroelectronics provides a calibration procedure in the application note AN5323, which involves measuring the sensor's capacitance and adjusting the internal registers accordingly.
  • Yes, the TSC210ICT is designed to work with a variety of touch sensor designs. However, the sensor design must meet the requirements specified in the datasheet, and the user must ensure that the sensor is properly connected to the TSC210ICT and calibrated for optimal performance.
  • Noise and interference can affect the performance of the TSC210ICT. To mitigate these issues, STMicroelectronics recommends using proper shielding, grounding, and filtering techniques, as well as implementing noise-reducing algorithms in the firmware.
  • The TSC210ICT is specified to operate from -40°C to 85°C, but the actual operating temperature range may vary depending on the specific application and environment. It is recommended to consult the datasheet and application notes for more information on temperature-related considerations.

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TSC210ICT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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