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TSM1012IDT - STMicroelectronics

Description: Low consumption voltage and current controller for battery chargers and adapters

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TSM1012IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_2022
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TSM1012IDT - STMicroelectronics  - 3D model - Small Outline Packages - SO 8_2022
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TSM1012IDT Details

  • Manufacturer Part Number:

    TSM1012IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MINISO-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.18 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TSM1012IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4965, which includes guidelines for component placement, routing, and thermal management.
  • The TSM1012IDT requires a specific power-up sequence and configuration. Refer to the datasheet and application note AN4965 for details on power-up sequencing, voltage regulator configuration, and clock configuration.
  • The TSM1012IDT has a high power density, so thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet and application note AN4965.
  • Use the debugging tools and techniques described in the datasheet and application note AN4965, such as using the built-in debug interface, monitoring voltage and current, and checking for thermal issues.
  • Yes, the TSM1012IDT is a high-frequency device and requires careful EMI/EMC design considerations. Follow the guidelines in the datasheet and application note AN4965 for PCB layout, shielding, and filtering.

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TSM1012IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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