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TSM102AIDR - Texas Instruments

Description: Dual Opamp, Dual Comparator with Precision Reference

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TSM102AIDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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TSM102AIDR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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TSM102AIDR Details

  • Manufacturer Part Number:

    TSM102AIDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.02 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1.3 V/us

  • Slew Rate-Nom:

    2 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2100

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

TSM102AIDR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TSM102AIDR involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The TSM102AIDR requires a single 3.3V or 5V power supply. It's recommended to power the device with a clean, low-noise power supply, and to sequence the power-on in the following order: VCC, then VIN. A 10uF decoupling capacitor should be placed close to the device.
  • The recommended input impedance for the TSM102AIDR is 50 ohms, and the recommended output impedance is also 50 ohms. This ensures maximum power transfer and minimal signal reflection.
  • The TSM102AIDR has a gain pin that can be connected to a resistor divider network to set the gain. The gain can be set to 1, 2, 4, or 8 by connecting the gain pin to VCC, GND, or a resistor divider network. The gain setting should be determined based on the specific application requirements.
  • The TSM102AIDR has a thermal pad that should be connected to a solid ground plane to dissipate heat. Additionally, the device should be placed in a well-ventilated area, and a heat sink can be used if necessary. The maximum junction temperature should not exceed 150°C.

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TSM102AIDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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