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TSM1052 - STMicroelectronics

Description: Constant voltage and constant current controller for battery chargers and adapters

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PCB Footprints
TSM1052 - STMicroelectronics PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-6_1
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3D Models
TSM1052 - STMicroelectronics  - 3D model - SOT23 (6-Pin) - SOT23-6_1
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TSM1052 Details

  • Manufacturer Part Number:

    TSM1052

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    ROHS COMPLIANT, SOT-23, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP6,.15

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TSM1052 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TSM1052 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability and prevent oscillations in the TSM1052, it is essential to follow the recommended layout and placement guidelines, use a sufficient output capacitor, and ensure that the input voltage is within the recommended range. Additionally, the device should be operated within the recommended temperature range, and the input and output capacitors should be selected based on the specific application requirements.
  • The maximum output current capability of the TSM1052 is 2A. However, the actual output current capability may be limited by the thermal performance of the device and the PCB. It is essential to ensure that the device is operated within the recommended temperature range and that the PCB is designed to dissipate heat efficiently.
  • The selection of input and output capacitors for the TSM1052 depends on the specific application requirements. The input capacitor should be selected based on the input voltage ripple and the output capacitor should be selected based on the output voltage ripple and the load requirements. A general rule of thumb is to use a 10uF to 22uF ceramic capacitor for the input and a 10uF to 47uF ceramic capacitor for the output.
  • The recommended input voltage range for the TSM1052 is 2.5V to 5.5V. Operating the device outside of this range may affect its performance and reliability.

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TSM1052 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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