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TSM108IDT - STMicroelectronics

Description: Step down controller with constant voltage/current

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TSM108IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO14 package
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TSM108IDT - STMicroelectronics  - 3D model - Small Outline Packages - SO14 package
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TSM108IDT Details

  • Manufacturer Part Number:

    TSM108IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, MICRO, SOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Additional Feature:

    CAN ALSO BE CONFIGURED IN CURRENT MODE OR VOLTAGE AND CURRENT MODE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    32 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    130 kHz

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

TSM108IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
  • The TSM108IDT has a thermal pad that must be connected to a heat sink or a thermal interface material to ensure proper cooling. A thermal resistance of less than 10°C/W is recommended.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause damage to the device.
  • The power-up sequence should be VCC first, followed by VIN, and then the input signals. This ensures proper initialization and prevents latch-up.
  • The recommended input impedance is 50 ohms, which ensures proper signal integrity and minimizes reflections.

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TSM108IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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