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TSM250NB06LDCRRLG - Taiwan Semiconductor

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TSM250NB06LDCRRLG - Taiwan Semiconductor PCB footprint - Other - Other - TSM250NB06LDCRRLG-3
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TSM250NB06LDCRRLG - Taiwan Semiconductor  - 3D model - Other - TSM250NB06LDCRRLG-3
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TSM250NB06LDCRRLG Details

  • Manufacturer Part Number:

    TSM250NB06LDCRRLG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN56, 8 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2020-01-20

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    25 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    26 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    2 W

  • Power Dissipation-Max (Abs):

    48 W

  • Pulsed Drain Current-Max (IDM):

    116 A

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

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TSM250NB06LDCRRLG Overview

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