The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and ensure that the device is operated within its specified temperature range. Additionally, consider using a heat sink or a thermoelectric cooler to reduce the junction temperature.
The maximum allowable voltage for the TSMP98000 is 120% of the rated voltage, but it is recommended to operate the device within the specified voltage range to ensure reliable operation and to prevent damage.
To handle ESD protection for the TSMP98000, it is recommended to follow proper ESD handling procedures, use ESD-protective packaging and materials, and consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design.
The recommended storage condition for the TSMP98000 is to store the devices in their original packaging, in a dry and clean environment, with a temperature range of -40°C to 30°C and a relative humidity of 60% or less.
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TSMP98000 Overview
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