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TSV524IPT - STMicroelectronics

Description: High merit factor (1.15 MHz for 45 μA) rail-to-rail 5 V op amp

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TSV524IPT - STMicroelectronics - PCB symbol
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PCB Footprints
TSV524IPT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - ST TSSOP14
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TSV524IPT - STMicroelectronics - 3D model - Small Outline Packages - ST TSSOP14
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TSV524IPT Details

  • Manufacturer Part Number:

    TSV524IPT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3100 µV

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    0.75 V/us

  • Supply Current-Max:

    0.24 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    1000

  • Width:

    4.4 mm

TSV524IPT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TSV524IPT is dependent on the package type and ambient temperature. For the DFN8 package, the maximum power dissipation is 320mW at 25°C. However, this value can be derated based on the ambient temperature and package thermal resistance.
  • To ensure stability, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, and using a low-ESR capacitor for decoupling. Additionally, the datasheet recommends a minimum gain of 5 for stable operation, and a phase margin of at least 45° to prevent oscillations.
  • The recommended input common-mode voltage range for the TSV524IPT is between VCC-1.5V and VCC-0.5V. Operating outside this range may result in reduced performance, increased power consumption, or even device damage.
  • While the TSV524IPT can be used as a comparator, it's not recommended due to its relatively slow slew rate (0.5V/μs) and limited output current (±20mA). STMicroelectronics offers dedicated comparator products, such as the TLV703, which are better suited for comparator applications.
  • The TSV524IPT has built-in ESD protection, but it's still essential to follow proper ESD handling practices during device handling and PCB assembly. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.

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TSV524IPT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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