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TSV611ICT - STMicroelectronics

Description: STMicroelectronics TSV611ICT CMOS Op Amp, 120kHz Rail-Rail, 1.5 → 5.5 V, 5-Pin SC-70

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PCB Footprints
TSV611ICT - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC70-5 (SOT323-5)
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TSV611ICT - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SC70-5 (SOT323-5)
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TSV611ICT Details

  • Manufacturer Part Number:

    TSV611ICT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    71 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    5

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.03 V/us

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    105

  • Voltage Gain-Min:

    5000

  • Wideband:

    NO

  • Width:

    1.25 mm

TSV611ICT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TSV611ICT is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RthJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper layout and decoupling practices, such as using a 10 nF to 100 nF capacitor between the power supply pins and the analog ground, and keeping the feedback loop as short as possible.
  • The recommended operating voltage range for the TSV611ICT is 2.7 V to 5.5 V, although the device can operate down to 2.2 V with reduced performance.
  • To minimize noise and oscillations, use a low-ESR capacitor (e.g., ceramic or film capacitor) for power supply decoupling, keep the input and output traces short and away from noise sources, and consider adding a noise filter or ferrite bead to the power supply lines.
  • While the TSV611ICT can be used as a comparator, it's not the most suitable device for this application due to its relatively slow slew rate and limited output current. A dedicated comparator IC would be a better choice for most comparator applications.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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