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TSV611ILT - STMicroelectronics

Description: STMicroelectronics TSV611ILT CMOS Op Amp, 120kHz Rail-Rail, 1.5 → 5.5 V, 5-Pin SOT-23

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TSV611ILT - STMicroelectronics PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT323-5L_STLQ50
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TSV611ILT - STMicroelectronics  - 3D model - SOT23 (5-Pin) - SOT323-5L_STLQ50
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TSV611ILT Details

  • Manufacturer Part Number:

    TSV611ILT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    71 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    5

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.03 V/us

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    5000

  • Wideband:

    NO

  • Width:

    1.6 mm

TSV611ILT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TSV611ILT is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RthJA) of 125°C/W.
  • To ensure stability, it's recommended to use a gain resistor (RG) between 1 kΩ and 10 kΩ, and a feedback capacitor (CF) between 10 pF and 100 pF, depending on the specific application and frequency range.
  • To minimize noise and EMI, it's recommended to use a star-ground configuration, keep the input and output traces short and symmetrical, and use a ground plane to shield the device. Additionally, decoupling capacitors (e.g., 100 nF) should be placed close to the device's power pins.
  • Yes, the TSV611ILT can be used in a single-supply configuration, but it's essential to ensure that the input common-mode voltage is within the specified range (VCC-1.5V to VCC-0.5V) to maintain optimal performance.
  • The TSV611ILT has a built-in input clamp that prevents the input voltage from exceeding the supply voltage. However, it's still recommended to use external clamping diodes or voltage-limiting resistors to protect the device from excessive input voltages.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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