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TSV630IQ2T - STMicroelectronics

Description: Rail-to-rail input/output 5V CMOS Op-Amp, micro-power (60uA), GBP=880kHz, single with standby

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TSV630IQ2T - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 2 x 2
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TSV630IQ2T - STMicroelectronics  - 3D model - Small Outline No-lead - DFN8 2 x 2
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TSV630IQ2T Details

  • Manufacturer Part Number:

    TSV630IQ2T

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    51 dB

  • Common-mode Reject Ratio-Nom:

    74 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    S-PDSO-N8

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Micropower:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    0.6 mm

  • Slew Rate-Min:

    0.2 V/us

  • Slew Rate-Nom:

    0.27 V/us

  • Supply Current-Max:

    0.062 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    790

  • Voltage Gain-Min:

    17782.79

  • Width:

    2 mm

TSV630IQ2T Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5096, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The output capacitor selection depends on the specific application requirements, such as output voltage ripple, noise tolerance, and ESR. A general guideline is to use a low-ESR ceramic capacitor with a value between 1uF to 10uF, and to follow the recommendations in the datasheet and application notes.
  • The TSV630IQ2T has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management and heat dissipation to prevent overheating.
  • Yes, the TSV630IQ2T is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, it's essential to follow the recommended design and testing guidelines to ensure compliance with the specific industry standards and requirements.
  • STMicroelectronics provides troubleshooting guidelines in the application note AN5096, which covers common issues and their solutions. Additionally, it's essential to follow proper design and layout practices, and to verify the component's operating conditions and parameters.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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