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TSV632IQ2T - STMicroelectronics

Description: Dual and quad, rail-to-rail input/output, 60 µA, 880 kHz operational amplifiers

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TSV632IQ2T - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 2 x 2 x 0.6 mm (NB)
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TSV632IQ2T - STMicroelectronics  - 3D model - Small Outline No-lead - DFN8 2 x 2 x 0.6 mm (NB)
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TSV632IQ2T Details

  • Manufacturer Part Number:

    TSV632IQ2T

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    74 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Slew Rate-Min:

    0.2 V/us

  • Slew Rate-Nom:

    0.27 V/us

  • Supply Current-Max:

    0.144 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    790

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    2 mm

TSV632IQ2T Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TSV632IQ2T is 670 mW, calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RthJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to verify the stability of your design.
  • The recommended operating voltage range for the TSV632IQ2T is 1.5 V to 5.5 V, with a maximum rating of 6.5 V. Operating outside this range may affect the device's performance and reliability.
  • The TSV632IQ2T is rated for operation up to 125°C (TJ). However, the device's performance and reliability may degrade at higher temperatures. If your application requires operation above 125°C, consider using a more suitable device or implementing thermal management techniques.
  • To prevent electrostatic discharge (ESD) damage, follow proper handling and storage procedures, use ESD-protective packaging and materials, and consider implementing ESD protection circuits in your design.

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TSV632IQ2T Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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