TSV632IST - STMicroelectronics

TSV632IST Details

• Manufacturer Part Number:

  TSV632IST

• Brand Name:

  STMicroelectronics

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  SOIC

• Package Description:

  SOP-8

• Pin Count:

  8

• Country Of Origin:

  Malaysia

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  STMicroelectronics

• YTEOL:

  8

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.0001 µA

• Bias Current-Max (IIB) @25C:

  0.00001 µA

• Common-mode Reject Ratio-Min:

  53 dB

• Common-mode Reject Ratio-Nom:

  74 dB

• Frequency Compensation:

  YES

• Input Offset Voltage-Max:

  4500 µV

• JESD-30 Code:

  S-PDSO-G8

• JESD-609 Code:

  e3

• Length:

  3 mm

• Low-Bias:

  YES

• Low-Offset:

  NO

• Micropower:

  YES

• Moisture Sensitivity Level:

  1

• Number of Functions:

  8

• Number of Terminals:

  2

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP8,.19

• Package Shape:

  SQUARE

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Packing Method:

  TR

• Peak Reflow Temperature (Cel):

  260

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Slew Rate-Min:

  0.2 V/us

• Slew Rate-Nom:

  0.27 V/us

• Supply Current-Max:

  0.124 mA

• Supply Voltage Limit-Max:

  6 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Matte Tin (Sn) - annealed

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Unity Gain BW-Nom:

  790

• Voltage Gain-Min:

  10000

• Wideband:

  NO

• Width:

  3 mm