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TSV6390ICT - STMicroelectronics

Description: Rail-to-rail input/output 5V CMOS Op-Amp, micro-power (60uA), GBP=2.4MHz, single with standby

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TSV6390ICT - STMicroelectronics PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC70-6
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TSV6390ICT - STMicroelectronics  - 3D model - SOT23 (6-Pin) - SC70-6
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TSV6390ICT Details

  • Manufacturer Part Number:

    TSV6390ICT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Package Description:

    ROHS COMPLIANT, SOT-323, SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    53 dB

  • Common-mode Reject Ratio-Nom:

    74 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    6

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.7 V/us

  • Supply Current-Max:

    0.072 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.25 mm

TSV6390ICT Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TSV6390ICT is from 2.7V to 5.5V, although it can operate down to 2.5V with some performance degradation.
  • To ensure stability, it's recommended to use a gain resistor (Rg) between 1kΩ and 10kΩ, and a feedback capacitor (Cf) between 10pF and 100pF, depending on the specific application and frequency range.
  • The TSV6390ICT can deliver up to 63mA of output current, making it suitable for driving small to medium-sized loads.
  • The TSV6390ICT has a built-in input protection circuit that prevents damage when the input common-mode voltage exceeds the supply rails. However, it's still recommended to ensure that the input voltage remains within the specified range to maintain optimal performance.
  • The TSV6390ICT is rated for operation up to 125°C, making it suitable for use in high-temperature environments. However, it's essential to ensure that the device is properly derated and that the application is designed to accommodate the reduced performance at elevated temperatures.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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