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TSV782IDT - STMicroelectronics

Description: High bandwidth (30MHz) Low offset (200µV) Rail-to-rail 5V op amp

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TSV782IDT - STMicroelectronics - PCB symbol
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TSV782IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 package
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TSV782IDT Details

  • Manufacturer Part Number:

    TSV782IDT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.000002 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    92 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    700 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    17 V/us

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    7.4 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    30000

  • Voltage Gain-Min:

    177827.941

  • Wideband:

    NO

  • Width:

    3.9 mm

TSV782IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure stability, it's essential to follow the recommended layout and component placement guidelines in the datasheet. Additionally, a minimum output capacitance of 10uF is recommended, and the output capacitor should be placed close to the output pin. A series resistor (Rs) can also be added to the output to prevent oscillations.
  • The maximum allowed input voltage ripple is not explicitly stated in the datasheet. However, as a general rule, it's recommended to keep the input voltage ripple below 10% of the nominal input voltage to ensure reliable operation and prevent noise coupling to the output.
  • The TSV782IDT is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended thermal design and derating guidelines to ensure reliable operation in high-temperature environments.
  • The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. The junction temperature can be estimated using the thermal resistance (Rthja) and the power dissipation: Tj = Ta + (Rthja x Pd), where Ta is the ambient temperature.

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TSV782IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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