TSV850AILT - STMicroelectronics

TSV850AILT Details

• Manufacturer Part Number:

  TSV850AILT

• Brand Name:

  STMicroelectronics

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  SOT-23

• Package Description:

  SOT-23, 6 PIN

• Pin Count:

  6

• Country Of Origin:

  Malaysia

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Factory Lead Time:

  18 Weeks

• Manufacturer:

  STMicroelectronics

• YTEOL:

  8

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.11 µA

• Bias Current-Max (IIB) @25C:

  0.06 µA

• Common-mode Reject Ratio-Min:

  70 dB

• Common-mode Reject Ratio-Nom:

  75 dB

• Frequency Compensation:

  YES

• Input Offset Voltage-Max:

  2000 µV

• JESD-30 Code:

  R-PDSO-G6

• Length:

  2.925 mm

• Low-Bias:

  NO

• Low-Offset:

  NO

• Micropower:

  YES

• Number of Functions:

  6

• Number of Terminals:

  1

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LSSOP

• Package Equivalence Code:

  TSOP6,.11,37

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

• Packing Method:

  TR

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.45 mm

• Slew Rate-Nom:

  0.6 V/us

• Supply Current-Max:

  0.18 mA

• Supply Voltage Limit-Max:

  6 V

• Supply Voltage-Nom (Vsup):

  2.7 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.95 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Unity Gain BW-Nom:

  1300

• Voltage Gain-Min:

  10000

• Wideband:

  NO

• Width:

  1.625 mm