Part Image

TSV852IST - STMicroelectronics

Description: TSV852IST STMicroelectronics, Low Power, Op Amp, 1.3MHz, 2.5 → 5.5 V, 8-Pin MSOP

Download TSV852IST Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TSV852IST - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MiniSO-8(H=1.1mm)
click to zoom
3D Models
TSV852IST - STMicroelectronics  - 3D model - Small Outline Packages - MiniSO-8(H=1.1mm)
click to zoom

TSV852IST Details

  • Manufacturer Part Number:

    TSV852IST

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MINISOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.11 µA

  • Bias Current-Max (IIB) @25C:

    0.06 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.36 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1300

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

TSV852IST Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, a minimum output capacitance of 10uF is recommended, and the output voltage should be decoupled with a 10nF capacitor to prevent oscillations.
  • The maximum allowed input voltage ripple is 100mVpp. Exceeding this value may affect the regulator's performance and stability. It's recommended to use a suitable input filter or decoupling capacitors to minimize input voltage ripple.
  • The TSV852IST is rated for operation up to 125°C. However, the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management and heat dissipation to prevent overheating and ensure reliable operation.
  • The power dissipation (PD) can be calculated using the formula: PD = (VIN - VOUT) x IOUT. The heat generation can be estimated using the thermal resistance (RthJA) and the power dissipation. STMicroelectronics provides a thermal model and calculation guidelines in the datasheet.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TSV852IST Overview

Use the download button to access the TSV852IST schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TSV85, or try a keyword search, such as Operational Amplifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

Parts related to TSV852IST

Showing 0 results