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TSX712IYST - STMicroelectronics

Description: Low-power, precision, rail-to-rail, 2.7 MHz, 16 V CMOS operational amplifiers

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TSX712IYST - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MiniSO-8(H=1.1mm)
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TSX712IYST - STMicroelectronics  - 3D model - Small Outline Packages - MiniSO-8(H=1.1mm)
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TSX712IYST Details

  • Manufacturer Part Number:

    TSX712IYST

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    98 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.2 µA

  • Input Offset Voltage-Max:

    450 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP8,.19,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2700

  • Voltage Gain-Min:

    316227.766

  • Wideband:

    NO

  • Width:

    3 mm

TSX712IYST Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a 10nF decoupling capacitor between VCC and GND, and a 100nF capacitor between AVCC and AGND.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the power lines. Ensure that the PCB layout is optimized for EMC, and use a ground plane to reduce radiation.
  • The TSX712IYST can operate from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal management, such as using a heat sink or thermal pad, to prevent overheating.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input lines. Ensure that the PCB layout is designed to minimize ESD susceptibility, and handle the device by the body or use an anti-static wrist strap during assembly.
  • Power up the device in the following sequence: VCC, AVCC, and then the input signals. Ensure that the power supplies are stable and within the recommended voltage range before applying input signals.

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TSX712IYST Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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