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TT320N16SOFHPSA1 - Infineon

Description: 50 mm Thyristor/Thyristor Module with 1600 V in solder bond technology

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TT320N16SOFHPSA1 - Infineon  - 3D model
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TT320N16SOFHPSA1 Details

  • Manufacturer Part Number:

    TT320N16SOFHPSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-7

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.03

  • Case Connection:

    ISOLATED

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • DC Gate Trigger Current-Max:

    150 mA

  • JESD-30 Code:

    R-XUFM-X7

  • Number of Elements:

    2

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    130 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RMS On-state Current-Max:

    520 A

  • Reference Standard:

    IEC-747-6; UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    1600 V

  • Repetitive Peak Reverse Voltage:

    1600 V

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SCR

TT320N16SOFHPSA1 Frequently Asked Questions (FAQs)

  • The TT320N16SOFHPSA1 can operate from -40°C to 150°C (TJ) and is suitable for automotive and industrial applications.
  • The device requires a gate-source voltage (VGS) of 10-15V for optimal performance. Ensure the gate driver is capable of providing this voltage range.
  • A low-inductance PCB layout is recommended, with short and wide traces for the high-current paths. Use multiple vias to connect the drain pad to the heat sink or PCB ground plane.
  • Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) mechanism, such as a fuse or current sense resistor, to prevent damage from voltage and current surges.
  • A heat sink with a thermal resistance of ≤ 1 K/W is recommended. Ensure good thermal contact between the device and heat sink using a suitable thermal interface material.

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TT320N16SOFHPSA1 Overview

Use the download button to access the TT320N16SOFHPSA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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