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TUSB1146RNQT - Texas Instruments

Description: USB Interface IC 16

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PCB Footprints
TUSB1146RNQT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RNQ0040A+
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3D Models
TUSB1146RNQT - Texas Instruments  - 3D model - Quad Flat No-Lead - RNQ0040A+
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TUSB1146RNQT Details

  • Manufacturer Part Number:

    TUSB1146RNQT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-05-24

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • JESD-30 Code:

    R-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NC

  • Number of Channels:

    5

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • On-state Resistance Match-Nom:

    2.5 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.17X.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TUSB1146RNQT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TUSB1146RNQT evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the TUSB1146RNQT has a built-in thermal protection feature that shuts down the device if the junction temperature exceeds 150°C.
  • The TUSB1146RNQT is a USB 3.2 Gen 1 device, but it is backward compatible with USB 2.0. However, using it in a USB 2.0-only system may limit its performance and functionality. For example, the device may not be able to take full advantage of its high-speed capabilities, and some features like SuperSpeed may not be available.
  • Texas Instruments provides a range of tools and resources to help troubleshoot issues with the TUSB1146RNQT, including application notes, FAQs, and technical support forums. Additionally, engineers can use signal integrity analysis tools, such as oscilloscopes and signal analyzers, to identify and debug issues with the device.
  • The TUSB1146RNQT has a typical active power consumption of 350 mW and a standby power consumption of 10 mW. To minimize power consumption, engineers can use power management techniques such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, the device has built-in power management features, such as automatic power-down and wake-up, to reduce power consumption when not in use.

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TUSB1146RNQT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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