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TUSB217ARWBR - Texas Instruments

Description: USB Interface IC USB 2.0 high-speed s ignal conditioner w

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TUSB217ARWBR - Texas Instruments PCB footprint - Other - Other - TUSB217ARWBR-1
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TUSB217ARWBR - Texas Instruments  - 3D model - Other - TUSB217ARWBR-1
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TUSB217ARWBR Details

  • Manufacturer Part Number:

    TUSB217ARWBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    USB SIGNAL CONDITIONER

  • JESD-30 Code:

    S-PQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Current-Max:

    36 mA

  • Supply Voltage-Max:

    6.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TUSB217ARWBR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TUSB217ARWBR datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane to minimize noise and EMI.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using thermal vias, and ensuring good airflow around the device. Additionally, TI recommends derating the device's operating temperature based on the ambient temperature and power dissipation.
  • Using a non-compliant cable in a USB 3.0 application with the TUSB217ARWBR can result in signal degradation, increased jitter, and reduced data transfer rates. It is essential to use compliant cables that meet the USB 3.0 specification to ensure reliable operation and optimal performance.
  • To troubleshoot issues with the TUSB217ARWBR, TI recommends using oscilloscopes and signal analyzers to measure signal quality and integrity. Additionally, engineers can use TI's USB 3.0 signal integrity tool to analyze and debug signal issues. It is also essential to review the device's datasheet and application notes to ensure proper device operation and configuration.
  • The TUSB217ARWBR has built-in ESD protection and latch-up prevention measures, including ESD diodes and clamp circuits. However, it is still essential to follow proper ESD handling and storage procedures to prevent damage to the device. Additionally, TI recommends using ESD protection devices and latch-up prevention circuits in the system design to ensure overall system reliability.

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TUSB217ARWBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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