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TUSB9261IPAPRQ1 - Texas Instruments

Description: Automotive 2nd Generation SuperSpeed USB 3.0 to Serial ATA Bridge

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TUSB9261IPAPRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
TUSB9261IPAPRQ1 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PAP (S-PQFP-G64)
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3D Models
TUSB9261IPAPRQ1 - Texas Instruments - 3D model - Quad Flat Packages - PAP (S-PQFP-G64)
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TUSB9261IPAPRQ1 Details

  • Manufacturer Part Number:

    TUSB9261IPAPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Bus Compatibility:

    ATA

  • Clock Frequency-Max:

    40 MHz

  • Data Transfer Rate-Max:

    375 MBps

  • Drive Interface Standard:

    IEEE 1149.6; IEEE 1149.1

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.155 V

  • Supply Voltage-Min:

    1.045 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

TUSB9261IPAPRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TUSB9261 Evaluation Module User's Guide (SLUUAC5). It's essential to follow the layout guidelines to minimize signal integrity issues and ensure reliable operation.
  • To configure the TUSB9261IPAPRQ1 for USB 3.0 SuperSpeed operation, set the MODE pin to HIGH and the SPEED pin to LOW. Additionally, ensure that the USB 3.0 signal lines are properly routed and terminated according to the USB 3.0 specification.
  • The TUSB9261IPAPRQ1 supports cable lengths up to 3 meters for USB 3.0 SuperSpeed operation. However, the actual cable length may vary depending on the specific application, cable quality, and signal integrity.
  • The TUSB9261IPAPRQ1 has a built-in power management feature that can be controlled through the PMODE pin. Set the PMODE pin to LOW to enable low-power mode, and set it to HIGH to enable high-power mode. Additionally, you can use external power management ICs to control the power supply to the device.
  • The TUSB9261IPAPRQ1 has a maximum junction temperature of 125°C. Ensure proper thermal design and heat dissipation to prevent overheating. Use thermal pads, heat sinks, or other thermal management techniques to keep the device within the recommended operating temperature range.

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TUSB9261IPAPRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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