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TUSS4440TRTJT - Texas Instruments

Description: TUSS4440TRTJT

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PCB Footprints
TUSS4440TRTJT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RTJ (S-PWQFN-N20)-
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3D Models
TUSS4440TRTJT - Texas Instruments  - 3D model - Quad Flat No-Lead - RTJ (S-PWQFN-N20)-
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TUSS4440TRTJT Details

  • Manufacturer Part Number:

    TUSS4440TRTJT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-12-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    LOG OR ANTILOG AMPLIFIER

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.34 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TUSS4440TRTJT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation. Additionally, ensure that the PCB is designed to withstand the high temperatures and that the components are selected with high-temperature ratings.
  • The internal ESD protection is designed to protect the device from electrostatic discharge events up to a certain level. However, it's not a substitute for external ESD protection. To supplement the internal protection, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from more severe ESD events.
  • To optimize the device's performance for low-power applications, consider reducing the operating frequency, using a lower supply voltage, and minimizing the load capacitance. Additionally, enable the device's power-saving features, such as the low-power mode, and consider using a DC-DC converter to reduce power consumption.
  • When using the TUSS4440TRTJT in a high-reliability or safety-critical application, consider the device's failure modes, fault detection, and fault tolerance. Ensure that the device is used within its recommended operating conditions, and that the system is designed to detect and respond to faults. Additionally, consider using redundant or duplicated systems to ensure continued operation in the event of a failure.

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TUSS4440TRTJT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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