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TUSS4470TRTJT - Texas Instruments

Description: Sensor Interface Direct drive ultrasonic sensor IC with logarithmic amplifier 20-QFN -25 to 105

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TUSS4470TRTJT - Texas Instruments - PCB symbol
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PCB Footprints
TUSS4470TRTJT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RTJ (S-PWQFN-N20)6
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3D Models
TUSS4470TRTJT - Texas Instruments - 3D model - Quad Flat No-Lead - RTJ (S-PWQFN-N20)6
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TUSS4470TRTJT Details

  • Manufacturer Part Number:

    TUSS4470TRTJT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-12-21

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    LOG OR ANTILOG AMPLIFIER

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.34 mA

  • Supply Voltage-Max (Vsup):

    36 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TUSS4470TRTJT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array with a minimum of 10 vias under the package to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • Texas Instruments recommends soldering the TUSS4470TRTJT using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Hand soldering is not recommended due to the device's small size and high pin count.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current to ensure they are within the specified operating ranges. Also, verify that the device is properly configured and that the output capacitor is of sufficient value and type.
  • Texas Instruments recommends using a high-quality, low-ESR ceramic capacitor with a value of 10-22 μF and a voltage rating of at least 2x the input voltage. The capacitor should be placed as close as possible to the device's input pins.

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TUSS4470TRTJT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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