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TX08F103F3435ER - Ohmite

Description: NTC Thermistors THERMISTOR 0805 10K/3435

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PCB Footprints
TX08F103F3435ER - Ohmite PCB footprint - Thermistors Chip - Thermistors Chip - 0805 (2012 metric)
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3D Models
TX08F103F3435ER - Ohmite  - 3D model - Thermistors Chip - 0805 (2012 metric)
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TX08F103F3435ER Details

  • Manufacturer Part Number:

    TX08F103F3435ER

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Manufacturer:

    Ohmite Mfg Co

  • YTEOL:

    8.8

  • Additional Feature:

    REFERENCE STANDARD: AEC-Q200

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.13 W

  • Rated Temperature:

    25 °C

  • Resistance:

    10000 Ω

  • Resistor Type:

    NTC THERMISTOR

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermal Sensitivity Index:

    3450 K

  • Thermistor Application:

    TEMPERATURE SENSING

  • Tolerance:

    1%

TX08F103F3435ER Frequently Asked Questions (FAQs)

  • The thermal resistance of the TX08F103F3435ER is typically around 20-30°C/W, depending on the mounting method and environment.
  • While the TX08F103F3435ER is a high-power resistor, it is not optimized for high-frequency applications. For frequencies above 100 kHz, the resistor's inductance and capacitance may affect its performance.
  • The TX08F103F3435ER is rated for operation up to 155°C, but its power rating decreases at higher temperatures. Consult the datasheet for derating information.
  • Use a soldering iron with a temperature of 250-270°C, and apply a small amount of solder paste or flux to the pads. Ensure the resistor is properly aligned and the solder joints are clean and free of oxidation.
  • Use a thermal relief pattern under the resistor to improve heat dissipation. Keep the PCB traces wide and short to minimize thermal resistance and voltage drops.

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