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TXS0206-29YFPRB - Texas Instruments

Description: MMC, SD Card, MemoryStick Voltage-Translation With ESD Protection, EMI Filtering, and 2.9 V LDO

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PCB Footprints
TXS0206-29YFPRB - Texas Instruments PCB footprint - BGA - BGA - YFP0020 DSBGA - 0.5 mm max height
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3D Models
TXS0206-29YFPRB - Texas Instruments  - 3D model - BGA - YFP0020 DSBGA - 0.5 mm max height
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TXS0206-29YFPRB Details

  • Manufacturer Part Number:

    TXS0206-29YFPRB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Delay-Max:

    10.6 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-XBGA-B20

  • JESD-609 Code:

    e1

  • Length:

    1.958 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Latch or Register:

    NONE

  • Output Low Current-Max:

    0.00002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    0.006 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.557 mm

TXS0206-29YFPRB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-speed PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines.
  • The TXS0206-29YFPRB has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Also, follow the recommended operating temperature range of -40°C to 85°C.
  • The maximum cable length supported by the TXS0206-29YFPRB depends on the specific application and the type of cable used. As a general guideline, the datasheet recommends keeping cable lengths under 1 meter to minimize signal degradation. However, longer cable lengths may be possible with proper signal conditioning and termination.
  • To troubleshoot issues with the TXS0206-29YFPRB, start by verifying the power supply voltage and ensuring that it is within the recommended range. Check for proper signal termination and impedance matching. Use an oscilloscope to verify signal integrity and check for noise or distortion. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • While the TXS0206-29YFPRB is designed for PCIe applications, it can be used in other high-speed applications with proper signal conditioning and termination. However, ensure that the device is operated within its recommended specifications and that the application meets the device's electrical and thermal requirements.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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